KESTER IS PROUD TO ANNOUNCE LAUNCH OF NP560 SOLDER PASTE - 03/18

Produktionsmittel(CPC)

KESTER IS PROUD TO ANNOUNCE LAUNCH OF NP560 SOLDER PASTE - 03/18

KESTER IS PROUD TO ANNOUNCE THE LAUNCH OF NP560 SOLDER PASTE - 03/18

Kester is product to announce the launch of NP560 - a no-clean, Pb-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for ultra-low voiding performance can achieve <5% voiding across different QFN sizes.

 

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Zvonimir Boras

Zvonimir Boras

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